The demand for optical transceivers in datacenters is growing at an unprecedented rate due to the rise of video streaming and cloud computing. The push for ever faster transceivers, at lower cost and in ever smaller packages is putting considerable strain on photonic transceiver devices. Key emerging technologies such as silicon photonics and flip chip assembly of integrated optical platforms are being developed to meet future needs. All however require to efficiently interface to fibre and waveguide architectures and provide low cost automated assembly while maintaining accuracy and performance. This project will involve the definition, design, development, fabrication and test of novel glass based photonic coupling structures using combined direct laser write, chemical etching and surface shaping. This is targeted to simplify assembly processes to transceiver platforms, for both Silicon Photonic and VCSEL based architectures, and provide high volume product solutions to meet anticipated future demand. The work will focus on achieving: a) low coupling losses b) relaxed alignment tolerances c) high levels of reliability. The coupling structures will be fabricated at Optoscribe’s state of the art clean room fabrication facility in Livingston and activities will span from optically modelling the structures using photonic design tools, to transferring designs into prototype manufacturing, taking the parts through processing, singulation and optical test.